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NC210 Low Melt

NC210 is the latest generation of solderpaste reflowing at a lower temperature than standard lead free alloys, therefore making it the ideal solution when regular reflow temperatures are unacceptable.

Alloy: 64Sn, 35Bi, 1Ag
Flux content: 11% RMA

Particle size: Type T4 20-38 Microns, T3 25-40 Microns