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LFS-UFP-T4

No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack.

Alloy: 96.5Sn, 3.0Ag, 0.5Cu
Flux content: 12% RMA

Particle size: Type T4 22-38 Micron

 

 

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